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B-320 RFID Die Bonding Machine

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B-320 RFID Die Bonding Machine
B-320 RFID Die Bonding Machine
B-320 RFID Die Bonding Machine
B-320 RFID Die Bonding Machine

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Key attributes

Other attributes

place of origin
CHINA
brand name
DAAN
Heat Pressure Range
0.55N~2N ±0.08N
Control Method and Power Supply
PLC Control, 220VAC
Heat Pressure Temperature
50~250C ±1C
Die Supply
Tray Plate
Die Bonding Accuracy
+-20um
Machine Weight and Power
About35kg, 200W
Machine Dimension
L640mm*W460mm*H600mm

Packaging and delivery

Packaging Details
CARTON BOX
Port
SHANTOU

Supply Ability

Supply Ability
5 Piece/Pieces per Week

Lead time

Product descriptions from the supplier

1 - 4 pieces
$9,800
>= 5 pieces
$9,200

Variations

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model number(1)

B-320

Shipping

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Standard refund policy

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1-year warranty

Access to free parts replacement and repair coverage

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