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B-320 RFID Die Bonding Machine
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Key attributes
Other attributes
Place of Origin
CHINA
Condition
New
Brand Name
DAAN
Heat Pressure Range
0.55N~2N ±0.08N
Control Method and Power Supply
PLC Control, 220VAC
Heat Pressure Temperature
50~250C ±1C
Die Supply
Tray Plate
Die Bonding Accuracy
+-20um
Machine Weight and Power
About35kg, 200W
Machine Dimension
L640mm*W460mm*H600mm
Packaging and delivery
Packaging Details
CARTON BOX
Port
SHANTOU
Supply Ability
Supply Ability
5 Piece/Pieces per Week
Lead time
| Quantity (pieces) | 1 - 1 | > 1 |
| Lead time (days) | 35 | To be negotiated |
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Product descriptions from the supplier
1 - 4 pieces
$9,800.00
>= 5 pieces
$9,200.00
Variations
Total options:
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